TY  - RPRT
TI  - Copper Conductivity Model Validation Method Using Flyer Plate Experiments and Simulations.
AU  - Riford, Lauren Stephanie
AU  - Lemke, Raymond W
AU  - Cochrane, Kyle Robert
PY  - 2013
UR  - https://www.osti.gov/biblio/1663319
ID  - 1663319
ER  -