@misc{indiciae51bcb2e550f6,
  title = {Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies},
  author = {Beers, Kimberly and Hollowell, Andrew E. and Basim, G. Bahar},
  year = {2020},
  doi = {10.1557/adv.2020.309},
  url = {https://www.osti.gov/biblio/1668694},
  note = {Source identifier: 1668694}
}