TY  - RPRT
TI  - Thin Film Characterization on Cu/SnAg Solder Interface for 3D Packaging Technologies
AU  - Beers, Kimberly
AU  - Hollowell, Andrew E.
AU  - Basim, G. Bahar
PY  - 2020
DO  - 10.1557/adv.2020.309
UR  - https://www.osti.gov/biblio/1668694
ID  - 1668694
ER  -