@misc{indiciaeda7da507ead1,
  title = {Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability},
  author = {Paret, Paul (ORCID:0000000312660922) and DeVoto, Douglas (ORCID:0000000348179647) and Major, Joshua (ORCID:0000000194240643) and Narumanchi, Sreekant (ORCID:0000000153376069)},
  year = {2020},
  doi = {10.1109/itherm45881.2020.9190318},
  url = {https://www.osti.gov/biblio/1686132},
  note = {Source identifier: 1686132}
}