@misc{indiciaeaa66b65988c1,
  title = {Solder Bond Fatigue is Insensitive to Module Size},
  author = {Bosco, Nick and Silverman, Timothy J.},
  year = {2021},
  doi = {10.1109/jphotov.2021.3074056},
  url = {https://www.osti.gov/biblio/1785334},
  note = {Source identifier: 1785334}
}