@misc{indiciae5f6c8cc3f7e5,
  title = {3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules},
  author = {Ke, Haotao and Mehrotra, Utkarsh and Hopkins, Douglas},
  year = {2021},
  doi = {10.1109/tpel.2021.3081679},
  url = {https://www.osti.gov/biblio/1787216},
  note = {Source identifier: 1787216}
}