TY  - RPRT
TI  - 3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules
AU  - Ke, Haotao
AU  - Mehrotra, Utkarsh
AU  - Hopkins, Douglas
PY  - 2021
DO  - 10.1109/tpel.2021.3081679
UR  - https://www.osti.gov/biblio/1787216
ID  - 1787216
ER  -