@misc{indiciaee8fa49682e62,
  title = {Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits},
  author = {Liu, Haotian (ORCID:0000000278875144) and Weibel, Justin A. and Sabau, Adrian S. and Geoghegan, Patrick and Chen, Jian and Groll, Eckhard A.},
  year = {2021},
  doi = {10.3390/ma14133485},
  url = {https://www.osti.gov/biblio/1798218},
  note = {Source identifier: 1798218}
}