TY  - RPRT
TI  - Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits
AU  - Liu, Haotian (ORCID:0000000278875144)
AU  - Weibel, Justin A.
AU  - Sabau, Adrian S.
AU  - Geoghegan, Patrick
AU  - Chen, Jian
AU  - Groll, Eckhard A.
PY  - 2021
DO  - 10.3390/ma14133485
UR  - https://www.osti.gov/biblio/1798218
ID  - 1798218
ER  -