@misc{indiciae7c0dbb2c0abb,
  title = {Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading: Preprint},
  author = {Spinella, Laura (ORCID:0000000349050626) and Terwilliger, Kent and Walker, Patrick and Perrin, Greg and Jiang, C.-S. and Bosco, Nick},
  year = {2021},
  url = {https://www.osti.gov/biblio/1811298},
  note = {Source identifier: 1811298}
}