@misc{indiciae6004cf02275a,
  title = {Multi-Scale Modeling of Electrically Conductive Adhesive Interconnect Reliability.},
  author = {Hartley, James Yuan and Bosco, Nick and Springer, Martin},
  year = {2020},
  url = {https://www.osti.gov/biblio/1822119},
  note = {Source identifier: 1822119}
}