TY  - RPRT
TI  - Multi-Scale Modeling of Electrically Conductive Adhesive Interconnect Reliability.
AU  - Hartley, James Yuan
AU  - Bosco, Nick
AU  - Springer, Martin
PY  - 2020
UR  - https://www.osti.gov/biblio/1822119
ID  - 1822119
ER  -