@misc{indiciaeb00cd73be453,
  title = {Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading},
  author = {Spinella, Laura (ORCID:0000000349050626) and Terwilliger, Kent and Walker, Patrick and Perrin, Greg and Jiang, Chun-Sheng and Bosco, Nick},
  year = {2021},
  doi = {10.1109/pvsc43889.2021.9518566},
  url = {https://www.osti.gov/biblio/1823796},
  note = {Source identifier: 1823796}
}