TY  - RPRT
TI  - Damage Evolution of Double-Sided Copper Conductor on Multi-layer Flexible Substrate Under Bending
AU  - Chen, Rui
AU  - Chow, Justin
AU  - Sitaraman, Suresh
PY  - 2022
UR  - https://www.osti.gov/biblio/1845129
ID  - 1845129
ER  -