@misc{indiciae5c2778539ae2,
  title = {Hardware Design of Medium Voltage SiC-Based Modular Multilevel Converters for Grid-Tied Applications},
  author = {Wang, Ke and Ma, Dihao and Hu, Boxue and Wang, Jin and Singh, Akanksha (ORCID:0000000238238140) and Mather, Barry (ORCID:0000000342017292)},
  year = {2021},
  doi = {10.1109/wipda49284.2021.9645106},
  url = {https://www.osti.gov/biblio/1846937},
  note = {Source identifier: 1846937}
}