@misc{indiciae2cb3fd80a3e9,
  title = {Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns},
  author = {Hossain Bhuiyan, Md Emran and Moreno, Salvador and Wang, Chao and Minary-Jolandan, Majid},
  year = {2021},
  doi = {10.1021/acsami.1c01890},
  url = {https://www.osti.gov/biblio/1852364},
  note = {Source identifier: 1852364}
}