@misc{indiciaefb0fe10f2430,
  title = {Identifying the microstructural features associated with void nucleation during elevated–temperature deformation of copper},
  author = {Noell, Philip J. and Deka, Nipal and Sills, Ryan B. and Boyce, Brad L.},
  year = {2022},
  doi = {10.1111/ffe.13707},
  url = {https://www.osti.gov/biblio/1877126},
  note = {Source identifier: 1877126}
}