@misc{indiciae023ec58900c4,
  title = {D03-0658: (Invited) Through-Silicon Via Copper Plating and Endpoint Detection.},
  author = {Schmitt, Rebecca and Perez, Carlos and Gonzales Kirkpatrick, Cielo and McClain, Jaime and McDow, Jessica and Jordan, Matthew and Baca, Ehren and Hollowell, Andrew},
  year = {2021},
  doi = {10.2172/1890622},
  url = {https://www.osti.gov/biblio/1890622},
  note = {Source identifier: 1890622}
}