@misc{indiciae848b7b547d0e,
  title = {Fine Pitch Bonding for High Density Interconnects},
  author = {Hirabayashi, Mieko and Jordan, Matthew and Hollowell, Andrew and Herrera, Sergio and Wiwi, Michael and Gutierrez, Jordan and Arterburn, Shawn},
  year = {2022},
  doi = {10.2172/1893991},
  url = {https://www.osti.gov/biblio/1893991},
  note = {Source identifier: 1893991}
}