@misc{indiciae8224218bf32d,
  title = {Interdiffusion and Formation of Intermetallic Compounds in High-Temperature Power Electronics Substrate Joints Fabricated by Transient Liquid Phase Bonding},
  author = {Imediegwu, Chidinma and Graham, Samuel and Pahinkar, Darshan G. and Narumanchi, Sreekant (ORCID:0000000153376069) and Paret, Paul (ORCID:0000000312660922) and Major, Joshua (ORCID:0000000194240643)},
  year = {2022},
  doi = {10.1016/j.microrel.2022.114788},
  url = {https://www.osti.gov/biblio/1897997},
  note = {Source identifier: 1897997}
}