TY  - RPRT
TI  - Interdiffusion and Formation of Intermetallic Compounds in High-Temperature Power Electronics Substrate Joints Fabricated by Transient Liquid Phase Bonding
AU  - Imediegwu, Chidinma
AU  - Graham, Samuel
AU  - Pahinkar, Darshan G.
AU  - Narumanchi, Sreekant (ORCID:0000000153376069)
AU  - Paret, Paul (ORCID:0000000312660922)
AU  - Major, Joshua (ORCID:0000000194240643)
PY  - 2022
DO  - 10.1016/j.microrel.2022.114788
UR  - https://www.osti.gov/biblio/1897997
ID  - 1897997
ER  -