@misc{indiciaeec6c2c9faa56,
  title = {Modeling of transient conduction in building envelope assemblies: A review},
  author = {Pilet, Tyler J. and Rakha, Tarek},
  year = {2022},
  doi = {10.1080/23744731.2022.2068315},
  url = {https://www.osti.gov/biblio/1995089},
  note = {Source identifier: 1995089}
}