TY  - RPRT
TI  - Modeling of transient conduction in building envelope assemblies: A review
AU  - Pilet, Tyler J.
AU  - Rakha, Tarek
PY  - 2022
DO  - 10.1080/23744731.2022.2068315
UR  - https://www.osti.gov/biblio/1995089
ID  - 1995089
ER  -