@misc{indiciae8fb86cd3dc66,
  title = {PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling},
  author = {Tian, Xingyue and Jia, Niu and DeVoto, Douglas and Paret, Paul and Bai, Hua and Tolbert, Leon M. and Cui, Han},
  year = {2023},
  doi = {10.1109/tpel.2023.3311440},
  url = {https://www.osti.gov/biblio/2005584},
  note = {Source identifier: 2005584}
}