TY  - RPRT
TI  - PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling
AU  - Tian, Xingyue
AU  - Jia, Niu
AU  - DeVoto, Douglas
AU  - Paret, Paul
AU  - Bai, Hua
AU  - Tolbert, Leon M.
AU  - Cui, Han
PY  - 2023
DO  - 10.1109/tpel.2023.3311440
UR  - https://www.osti.gov/biblio/2005584
ID  - 2005584
ER  -