TY  - RPRT
TI  - Model Validation of a Modular Foam Encapsulated Electronics Assembly with Controlled Preloads Via Additively Manufactured Silicone Lattices.
AU  - Ballance, Tanner
AU  - Lindsey, Bryce
AU  - Saraphis, Daniel
AU  - Long, Kevin
AU  - Khan, Moheimin
AU  - Kramer, Sharlotte Lorraine Bolyard
AU  - Roberts, Christine
PY  - 2022
DO  - 10.1007/978-3-031-36999-5_21
UR  - https://www.osti.gov/biblio/2005729
ID  - 2005729
ER  -