@misc{indiciae082242cdd57c,
  title = {Optimizing Copper Deposition in High Aspect Ratio Through Silicon Vias.},
  author = {McDow, Jessica and Schmitt, Rebecca and Hirabayashi, Mieko and McClain, Jaime and Jordan, Matthew},
  year = {2022},
  doi = {10.2172/2005916},
  url = {https://www.osti.gov/biblio/2005916},
  note = {Source identifier: 2005916}
}