TY  - RPRT
TI  - Optimizing Copper Deposition in High Aspect Ratio Through Silicon Vias.
AU  - McDow, Jessica
AU  - Schmitt, Rebecca
AU  - Hirabayashi, Mieko
AU  - McClain, Jaime
AU  - Jordan, Matthew
PY  - 2022
DO  - 10.2172/2006005
UR  - https://www.osti.gov/biblio/2006005
ID  - 2006005
ER  -