@misc{indiciae97b5f2b8fa7c,
  title = {Cement stress and microstructure evolution during curing in semi-rigid high-pressure environments},
  author = {Meng, Meng and Frash, Luke P. and William Carey, J. and Li, Wenfeng and Welch, Nathan J. and Zhang, Weicheng},
  year = {2021},
  doi = {10.1016/j.cemconres.2021.106555},
  url = {https://www.osti.gov/biblio/23206209},
  note = {Source identifier: 23206209}
}