TY  - RPRT
TI  - Cement stress and microstructure evolution during curing in semi-rigid high-pressure environments
AU  - Meng, Meng
AU  - Frash, Luke P.
AU  - William Carey, J.
AU  - Li, Wenfeng
AU  - Welch, Nathan J.
AU  - Zhang, Weicheng
PY  - 2021
DO  - 10.1016/j.cemconres.2021.106555
UR  - https://www.osti.gov/biblio/23206209
ID  - 23206209
ER  -