TY  - RPRT
TI  - Packaging Development for a 1200V SiC BiDFET Switch Using Highly Thermally Conductive Organic Epoxy Laminate
AU  - Mehrotra, Utkarsh
AU  - Cheng, Tzu-Hsuan
AU  - Kanale, Ajit (ORCID:0000000322743617)
AU  - Agarwal, Aditi (ORCID:0000000345943398)
AU  - Han, Kijeong (ORCID:0000000210060694)
AU  - Baliga, B. Jayant (ORCID:0000000191710080)
AU  - Bhattacharya, Subhashish (ORCID:0000000193115744)
AU  - Hopkins, Douglas C. (ORCID:0000000189157212)
PY  - 2020
DO  - 10.1109/ispsd46842.2020.9170116
UR  - https://www.osti.gov/biblio/2324646
ID  - 2324646
ER  -