@misc{indiciae0f792c3da244,
  title = {Thermal simulation of the EIC HSR interconnect module - RF fingers},
  author = {Micolon, Federic and Bellon, J. and Hetzel, C. and Sangroula, M. and Verdu-Andres, S.},
  year = {2024},
  doi = {10.2172/2367449},
  url = {https://www.osti.gov/biblio/2367449},
  note = {Source identifier: 2367449}
}