@misc{indiciaeab69f1b9e9ad,
  title = {High Performance SiC Power Module Based on Repackaging of Discrete SiC Devices},
  author = {Chen, Zibo and Huang, Alex Q.},
  year = {2023},
  doi = {10.1109/tpel.2023.3263466},
  url = {https://www.osti.gov/biblio/2423957},
  note = {Source identifier: 2423957}
}