@misc{indiciaea46b93b0699c,
  title = {Die Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications},
  author = {Li, Xingchen and Jia, Xiaofan and Kim, Joon Woo and Moon, Kyoung-sik and Jordan, Matthew and Swaminathan, Madhavan},
  year = {2023},
  doi = {10.1109/ectc51909.2023.00389},
  url = {https://www.osti.gov/biblio/2431830},
  note = {Source identifier: 2431830}
}