TY  - RPRT
TI  - Die Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications
AU  - Li, Xingchen
AU  - Jia, Xiaofan
AU  - Kim, Joon Woo
AU  - Moon, Kyoung-sik
AU  - Jordan, Matthew
AU  - Swaminathan, Madhavan
PY  - 2023
DO  - 10.1109/ectc51909.2023.00389
UR  - https://www.osti.gov/biblio/2431830
ID  - 2431830
ER  -