@misc{indiciaec9cd81c7ae1c,
  title = {Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs)},
  author = {Bora, M},
  year = {2024},
  url = {https://www.osti.gov/biblio/2447046},
  note = {Source identifier: 2447046}
}