TY  - RPRT
TI  - Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs)
AU  - Bora, M
PY  - 2024
UR  - https://www.osti.gov/biblio/2447046
ID  - 2447046
ER  -