@misc{indiciaec449778e9124,
  title = {Reduction of vanadium diffusivity within copper grain boundaries due to enhanced binding},
  author = {Liu, T. Y. [Texas A\&M University, College Station, TX (United States); Texas A\&M University] (ORCID:0000000171886986) and Sheu, E. [Texas A\&M University, College Station, TX (United States)] (ORCID:0000000162436684) and Tavakolzadeh, M. [Texas A\&M University, College Station, TX (United States)] and Williams, D. J. [Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)] and Baldwin, J. K. [Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)] and Demkowicz, M. J. [Texas A\&M University, College Station, TX (United States)] (ORCID:0000000273053045)},
  year = {2024},
  doi = {10.1016/j.scriptamat.2024.116515},
  url = {https://www.osti.gov/biblio/2481681},
  note = {Source identifier: 2481681}
}