@misc{indiciaebfe75eb108ed,
  title = {Final Technical Report: High Thermal Conductivity, Multi-Layer, AlN-Based PCB Enabling Rapid Prototyping with Embedded Printed Components},
  author = {Zinn, Alfred},
  year = {2026},
  url = {https://www.osti.gov/biblio/2496293},
  note = {Source identifier: 2496293}
}