@misc{indiciae75ed08514332,
  title = {Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding},
  author = {Harris, John and Huitink, David},
  year = {2024},
  doi = {10.1109/itherm55375.2024.10709536},
  url = {https://www.osti.gov/biblio/2497310},
  note = {Source identifier: 2497310}
}