TY  - RPRT
TI  - Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding
AU  - Harris, John
AU  - Huitink, David
PY  - 2024
DO  - 10.1109/itherm55375.2024.10709536
UR  - https://www.osti.gov/biblio/2497310
ID  - 2497310
ER  -