@misc{indiciae9bef73d7928f,
  title = {A Printed Microscopic Universal Gradient Interface for Super Stretchable Strain‐Insensitive Bioelectronics},
  author = {Song, Kaidong [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Zhou, Jingyuan [Chemistry and Biochemistry Department University of California Los Angeles Los Angeles CA 90095 USA] and Wei, Chen [Department of Mechanical and Aerospace Engineering University of California Los Angeles Los Angeles CA 90095 USA] and Ponnuchamy, Ashok [Department of Electrical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Bappy, Md Omarsany [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Liao, Yuxuan [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Jiang, Qiang [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Du, Yipu [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Evans, Connor J. [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Wyatt, Brian C. [School of Materials Engineering Purdue University West Lafayette IN 47907 USA] and O’ Sullivan, Thomas [Department of Electrical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Roeder, Ryan K. [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Anasori, Babak [School of Materials Engineering Purdue University West Lafayette IN 47907 USA] and Hoffman, Anthony J. [Department of Electrical Engineering University of Notre Dame Notre Dame IN 46556 USA] and Jin, Lihua [Department of Mechanical and Aerospace Engineering University of California Los Angeles Los Angeles CA 90095 USA] and Duan, Xiangfeng [Chemistry and Biochemistry Department University of California Los Angeles Los Angeles CA 90095 USA] and Zhang, Yanliang [Department of Aerospace and Mechanical Engineering University of Notre Dame Notre Dame IN 46556 USA] (ORCID:0000000174238001)},
  year = {2025},
  doi = {10.1002/adma.202414203},
  url = {https://www.osti.gov/biblio/2513912},
  note = {Source identifier: 2513912}
}