@misc{indiciaeda888cf9f527,
  title = {Modeling Heat Flow Across a Compression Bonded GaN-Diamond Interface for Vertical Power Devices},
  author = {Cook, Esteban Alfonso and Hodges, Wyatt Lea and Jarzembski, Amun and Delmas, William Grant and Bahr, Matthew Nathaniel and Piontkowski, Zachary Tyler and Treweek, Benjamin and Deitz, Julia Irene and McDonald, Anthony E. and Antiporda, Logan and Lu, Ping and Yates, Luke},
  year = {2024},
  doi = {10.2172/2563921},
  url = {https://www.osti.gov/biblio/2563921},
  note = {Source identifier: 2563921}
}