TY  - RPRT
TI  - Device- and System-Level Thermal Packaging for Electric-Drive Technologies (Final Technical Report)
AU  - Joshi, Yogendra [Georgia Institute of Technology, Atlanta, GA (United States)]
AU  - Graham, Samuel [Univ. of Maryland, College Park, MD (United States)]
AU  - Kumar, Satish [Georgia Institute of Technology, Atlanta, GA (United States)]
PY  - 2025
DO  - 10.2172/2569385
UR  - https://www.osti.gov/biblio/2569385
ID  - 2569385
ER  -