@misc{indiciae15a635b794e3,
  title = {2.5D HI Packaging of the Power Converter using TSV interposer.},
  author = {Chung, Hyunim and Young, Andrew Ian and Klein, Brianna Alexandra and McDonough, Matthew and Neely, Jason Christopher},
  year = {2023},
  doi = {10.2172/2584822},
  url = {https://www.osti.gov/biblio/2584822},
  note = {Source identifier: 2584822}
}