TY  - RPRT
TI  - Si–Cl 2 –Ar + Atomic Layer Etching Window: A Fundamental Study Using Molecular Dynamics Simulations and a Reduced Order Model
AU  - Vella, Joseph R. [TEL Technology Center, America, LLC, Albany, NY (United States)] (ORCID:0000000286668719)
AU  - Graves, David B. [Princeton Univ., NJ (United States)]
PY  - 2025
DO  - 10.1021/acs.jpcb.5c01378
UR  - https://www.osti.gov/biblio/2586627
ID  - 2586627
ER  -