@misc{indiciae7e51143dfe3c,
  title = {Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science},
  author = {Tao, Ran [United States Department of Commerce] and Centellas, Polette [United States Department of Commerce] and Romberg, Stian [United States Department of Commerce] and Kotula, Anthony [United States Department of Commerce] and Holmes, Gale [United States Department of Commerce] and Forster, Amanda [United States Department of Commerce] and Soles, Christopher [United States Department of Commerce] and Allen, Robert [National Renewable Energy Lab., Golden, CO (United States)] and Cetegen, Edvin [Intel] and Chen, William [Advanced Semiconductor Engineering, Inc.] and Gotro, Jeffrey [Innocentrix LLC] and Poliks, Mark [Binghamton University]},
  year = {2025},
  doi = {10.1109/tcpmt.2025.3603484},
  url = {https://www.osti.gov/biblio/2588192},
  note = {Source identifier: 2588192}
}