TY  - RPRT
TI  - Material Needs and Measurement Challenges for Advanced Semiconductor Packaging: Understanding the Soft Side of Science
AU  - Tao, Ran [United States Department of Commerce]
AU  - Centellas, Polette [United States Department of Commerce]
AU  - Romberg, Stian [United States Department of Commerce]
AU  - Kotula, Anthony [United States Department of Commerce]
AU  - Holmes, Gale [United States Department of Commerce]
AU  - Forster, Amanda [United States Department of Commerce]
AU  - Soles, Christopher [United States Department of Commerce]
AU  - Allen, Robert [National Renewable Energy Lab., Golden, CO (United States)]
AU  - Cetegen, Edvin [Intel]
AU  - Chen, William [Advanced Semiconductor Engineering, Inc.]
AU  - Gotro, Jeffrey [Innocentrix LLC]
AU  - Poliks, Mark [Binghamton University]
PY  - 2025
DO  - 10.1109/tcpmt.2025.3603484
UR  - https://www.osti.gov/biblio/2588192
ID  - 2588192
ER  -