@misc{indiciae921afe299675,
  title = {Thermal stability of 3D interface Cu/Nb nanolaminates},
  author = {Cheng, Justin Y. [Univ. of Minnesota, Minneapolis, MN (United States)] (ORCID:0000000223391142) and Li, Zezhou [Beijing Institute of Technology (China)] and Poerschke, David L. [Univ. of Minnesota, Minneapolis, MN (United States)] (ORCID:000000026206235X) and Baldwin, J. Kevin [Los Alamos National Laboratory (LANL), Los Alamos, NM (United States). Center for Integrated Nanotechnologies (CINT)] and Bresnahan, Brady L. [Univ. of Minnesota, Minneapolis, MN (United States)] (ORCID:0000000293379050) and Mara, Nathan A. [Univ. of Minnesota, Minneapolis, MN (United States)] (ORCID:0000000291354693)},
  year = {2024},
  doi = {10.1016/j.scriptamat.2024.116319},
  url = {https://www.osti.gov/biblio/2945612},
  note = {Source identifier: 2945612}
}