TY  - RPRT
TI  - Thermal stability of 3D interface Cu/Nb nanolaminates
AU  - Cheng, Justin Y. [Univ. of Minnesota, Minneapolis, MN (United States)] (ORCID:0000000223391142)
AU  - Li, Zezhou [Beijing Institute of Technology (China)]
AU  - Poerschke, David L. [Univ. of Minnesota, Minneapolis, MN (United States)] (ORCID:000000026206235X)
AU  - Baldwin, J. Kevin [Los Alamos National Laboratory (LANL), Los Alamos, NM (United States). Center for Integrated Nanotechnologies (CINT)]
AU  - Bresnahan, Brady L. [Univ. of Minnesota, Minneapolis, MN (United States)] (ORCID:0000000293379050)
AU  - Mara, Nathan A. [Univ. of Minnesota, Minneapolis, MN (United States)] (ORCID:0000000291354693)
PY  - 2024
DO  - 10.1016/j.scriptamat.2024.116319
UR  - https://www.osti.gov/biblio/2945612
ID  - 2945612
ER  -